化学機械研磨
1. Chemical-mechanical planarizationChemical Mechanical Polishing/Planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.
Read “Chemical-mechanical planarization” on English Wikipedia
Read “化学機械研磨” on Japanese Wikipedia
Read “Chemical-mechanical planarization” on DBpedia
Read “Chemical-mechanical planarization” on English Wikipedia
Read “化学機械研磨” on Japanese Wikipedia
Read “Chemical-mechanical planarization” on DBpedia
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