1. Hong Kong Letters PatentThe Hong Kong Letters Patent was one of the two principal constitutional instruments of Hong Kong during the period of its administration as a colony under British administration. (The other principal instrument was the Hong Kong Royal Instructions). Originally issued in the form of a royal charter on 5 April 1843, the Letters Patent were reissued on on 19 January 1888, and again on 14 February 1917.
Read “Hong Kong Letters Patent” on English Wikipedia
Read “英皇制誥” on Japanese Wikipedia
Read “Hong Kong Letters Patent” on DBpedia
Read “Hong Kong Letters Patent” on English Wikipedia
Read “英皇制誥” on Japanese Wikipedia
Read “Hong Kong Letters Patent” on DBpedia
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