Si貫通電極
1. Through-silicon viaIn electronic engineering, a through-silicon via (TSV) is a vertical electrical connection(Vertical Interconnect Access) passing completely through a silicon wafer or die. TSVs are a high performance technique used to create 3D packages and 3D integrated circuits, compared to alternatives such as package-on-package, because the density of the vias is substantially higher, and because the length of the connections is shorter.
Read “Through-silicon via” on English Wikipedia
Read “Si貫通電極” on Japanese Wikipedia
Read “Through-silicon via” on DBpedia
Read “Through-silicon via” on English Wikipedia
Read “Si貫通電極” on Japanese Wikipedia
Read “Through-silicon via” on DBpedia
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