パッケージ (電子部品)
1. Integrated circuit packagingIntegrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing. The die, which represents the core of the device, is encased in a support that prevents physical damage and corrosion and supports the electrical contacts required to assemble the integrated circuit into a system. In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly.
Read “Integrated circuit packaging” on English Wikipedia
Read “パッケージ (電子部品)” on Japanese Wikipedia
Read “Integrated circuit packaging” on DBpedia
Read “Integrated circuit packaging” on English Wikipedia
Read “パッケージ (電子部品)” on Japanese Wikipedia
Read “Integrated circuit packaging” on DBpedia
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