ダイシング
1. dicing (e.g. cutting up of a microchip wafer)
2. Die preparationDie preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer mounting and wafer dicing.
Read “Die preparation” on English Wikipedia
Read “ダイシング” on Japanese Wikipedia
Read “Die preparation” on DBpedia
Read “Die preparation” on English Wikipedia
Read “ダイシング” on Japanese Wikipedia
Read “Die preparation” on DBpedia
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