反応性イオンエッチング
1. Reactive-ion etchingReactive-ion etching (RIE) is an etching technology used in microfabrication. It uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.
Read “Reactive-ion etching” on English Wikipedia
Read “反応性イオンエッチング” on Japanese Wikipedia
Read “Reactive-ion etching” on DBpedia
Read “Reactive-ion etching” on English Wikipedia
Read “反応性イオンエッチング” on Japanese Wikipedia
Read “Reactive-ion etching” on DBpedia
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